LACH DIAMANT presents at the PRODUCTRONICA in Munich
Trimming of multilayer printed circuit boards
50 % time saving
with cutting and burr-free milling in one processing step.
LACH DIAMANT has developed new tools for a combination system which enables tool lives up to 20.000 meters and more.
Due to innovative shape of the diamond edge the waste (cut-off) side of the multilayer printed circuit board is transported away sideways from the diamond tool.
The simultaneously obtained burr-free edge distinguishes the solution found by LACH DIAMANT from other tool designs.
In standard style this combination tool set consists of a
LACH DIAMANT cut-off saw ø 103 – 2 – 40/25° – 0,35, Z = 30 and a LACH DIAMANT-Fräser ø 85 – 6,5/6 – 40, Z = 8 bzw. Z = 12.