Electroplated diamond and CBN bonds allow excellent sharpness of the abrasive layers and very high grinding performances. This benefits single-layered grinding wheels, pins and files.
For electroplated bonds the diamond or CBN grit is embedded in a nickel bond. Grits jut out of the bond by approximately 30-50%, the depth of rim is 1,5 times the amount of the grit size. This enables a resilient bond with high removal rates.
Recommended use: GRP, CFRP, processing of carbide and ceramic green bodies
Special customer-specific versions are possible.